In semiconductor production, absolute cleanliness is of paramount importance. That is why we rely on highly specialized cleaning processes, ranging from wet cleaning and inline vacuum drying to final packaging under cleanroom conditions. Each assembly is inspected according to customer specifications (e.g., under ISO-5 or ISO-7 conditions) and undergoes comprehensive testing, such as helium leak tests (up to 10^-10) or particle analysis (UV black light analysis / RGA / TOC / APC), as well as bake-out. The result: precision-manufactured, ultra-clean, and reliable results.
Yes, Witzenmann offers solutions for demanding UHP and UHV applications, particularly in the semiconductor industry.
Witzenmann serves customers worldwide through its international subsidiaries in South Korea, Japan, and the United States, among other locations.
The Witzenmann portfolio includes high-purity membrane bellows, corrugated bellows, precision bellows, bellows for vacuum valves, corrugated hoses, spiral hoses, and custom assemblies for UHP and UHV applications.
Witzenmann sees itself as a development partner for UHP and UHV applications. Using design software, in-depth expert knowledge, and test benches for practical validation, the company works with customers to develop customized solutions.
Diaphragm bellows consist of individually welded diaphragm discs and offer a high degree of flexibility, particularly for vacuum applications. Corrugated bellows are manufactured from formed metal tubes and are particularly suitable for higher pressure loads.
Leak testing is performed using a helium leak test in accordance with the respective customer requirements. Typical leak rates are around 10⁻⁸ mbar l/s. Depending on the application, leak rates as low as 10⁻¹⁰ mbar l/s can also be detected.
Witzenmann ensures component quality throughout the entire supply chain: from the procurement of certified materials through controlled and verified manufacturing to final cleaning, vacuum drying, and packaging under cleanroom conditions. Complemented by 100% inspections and documented quality processes, this ensures high purity, process reliability, and complete traceability.
In semiconductor manufacturing, the cleanliness of individual components determines the yield of entire wafer batches. UHP and UHV components must therefore be free of particles, residual moisture, and outgassing; remain permanently leak-tight; and be protected from contamination until they are installed. This is what our “Precise & Clean” commitment stands for.
Witzenmann views semiconductor applications not as individual components, but as assemblies. From semi-finished products to verified, high-purity, ready-to-install flexible products, the entire process takes place under one roof—across the entire portfolio of diaphragm bellows, corrugated bellows, metal hoses, hybrid metal-plastic solutions, and assemblies.
This is how we reduce interfaces and ensure a high degree of process reliability and consistent quality. From design to leak testing of the finished assembly—all from a single source.
Nothing beats direct contact. We are happy to take the time for a personal discussion with you to answer your questions on an individual basis.
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